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ISL21080
Typical Performance Characteristics Curves
5.3
T A = +25°C unless otherwise specified.
5.2
5.1
5.0
4.9
4.8
NO LOAD
7mA
4.7
5.0
5.2
5.4
5.6
5.8
6.0
V IN (V)
FIGURE 34. DROPOUT, ISL21080-50
High Current Application
1.502
1.500
1.498
1.496
1.494
V IN = 5V
V IN = 3.5V
V IN = 3.3V
1.502
1.500
1.498
1.496
1.494
V IN = 5V
V IN = 3.5V
V IN = 3.3V
1.492
0
5
10
15
20
25
30
35
1.492
0
5
10
15
20
25
30
35
I LOAD (mA)
FIGURE 35. DIFFERENT V IN AT ROOM TEMPERATURE
Applications Information
FGA Technology
The ISL21080 series of voltage references use the
floating gate technology to create references with very
low drift and supply current. Essentially, the charge
stored on a floating gate cell is set precisely in
manufacturing. The reference voltage output itself is a
buffered version of the floating gate voltage. The
resulting reference device has excellent characteristics
which are unique in the industry: very low temperature
drift, high initial accuracy, and almost zero supply
current. Also, the reference voltage itself is not limited by
voltage bandgaps or zener settings, so a wide range of
reference voltages can be programmed (standard
voltage settings are provided, but customer-specific
voltages are available).
The process used for these reference devices is a floating
gate CMOS process, and the amplifier circuitry uses CMOS
transistors for amplifier and output transistor circuitry.
While providing excellent accuracy, there are limitations in
14
I LOAD (mA)
FIGURE 36. DIFFERENT V IN AT HIGH TEMPERATURE
(+85°C )
output noise level and load regulation due to the MOS
device characteristics. These limitations are addressed with
circuit techniques discussed in other sections.
Board Assembly Considerations
FGA references provide high accuracy and low
temperature drift but some PC board assembly
precautions are necessary. Normal Output voltage shifts
of 100μV to 1mV can be expected with Pb-free reflow
profiles or wave solder on multi-layer FR4 PC boards.
Precautions should be taken to avoid excessive heat or
extended exposure to high reflow or wave solder
temperatures, this may reduce device initial accuracy.
Post-assembly x-ray inspection may also lead to permanent
changes in device output voltage and should be minimized
or avoided. If x-ray inspection is required, it is advisable to
monitor the reference output voltage to verify excessive
shift has not occurred. If large amounts of shift are
observed, it is best to add an X-ray shield consisting of thin
zinc (300μm) sheeting to allow clear imaging, yet block
x-ray energy that affects the FGA reference.
FN6934.4
May 25, 2010
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